6 major technical performance characteristics of Loctite epoxy glue

6 technical performance characteristics of epoxy adhesive

1. Low shrinkage of glue

Epoxy resin molecules are closely arranged, low molecular weight does not separate when cured, and can be formulated into solvent-free adhesives, so the shrinkage rate is usually low. The shortening rate can be reduced to 0.1-0.2% if appropriate fillers are selected.

2. Strong corrosion resistance

Loctite epoxy resin structure has stable benzene ring, ether bond and cured structure after curing. The resolution of epoxy resin adhesive has strong resistance to the influence of atmosphere, humidity, chemical medium, bacteria, etc., so it can be used for Multiple uses in more demanding environments.

3. Good technical performance

Depending on the type of curing agent selected, epoxy adhesives can be cured at room temperature, medium temperature, or high temperature. Usually only 0.1-0.5MPa contact pressure is required for curing. Most epoxy adhesives are solvent-free and easy to handle. Usually the construction viscosity, service life and curing speed of epoxy adhesives can be adjusted by formula to meet various requirements. This not only facilitates the guarantee of bonding quality, but also simplifies the curing process and equipment.

4. Excellent electrical insulation properties

When epoxy cures, excellent electrical insulation is achieved:

Breakdown voltage≥35kV/mm

Volume resistance≥1015Ω?cm

Dielectric constant 3～4(50Hz)

Arc resistance 100～140s

5. Adaptability

Epoxy adhesives obtain a series of adhesive formulations with different functions by changing their components (curing agents, toughening agents, fillers, etc.) to meet various needs, and have a variety of modifiers (such as phenolic resins, nitrile rubber etc.) . .) mixed to produce various types of functions. 6. High heat resistance and low water absorption

The operating temperature of bisphenol A epoxy resin is usually -60 to +175°C, sometimes as high as 200°C. If a new epoxy resin with high and low temperature resistance is used, the working temperature can be high or low, and the ring can be used. Oxygen resin has low water absorption.