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Adhesive and Adhesive Adaptability of Hot Melt Adhesive (2)

April 04, 2023
Second, different uses of different properties of hot sol


Films and glues are made of hot-melt adhesives, which are new adhesive materials. However, film-covering and glue-binding are two processes. Different basic materials can be processed in different ways to achieve different results. Hot melt adhesives used for different applications have different properties.


(I) Hot melt adhesive for film


Film is a composite of BOPP film and paper prints. This composite is composed of BOPP (polypropylene resin high temperature biaxially oriented) plastic film, a paper substrate, and an ink layer printed thereon three different substances. In addition to the basic conditions of fast initial adhesion and anti-aging, the hot melt adhesive used for coating has three kinds of polar substances: BOPP plastic film, ink layer, and paper, and has good affinity. Sex and wettability can guarantee the adhesion, hold for a long time, and withstand the impact, erosion and decomposition of the physical and chemical functions under various reprocessing conditions after coating.


1. The basic composition unit of hot melt adhesive for film coating (see Figure 2)


The basic components of hot-melt adhesives for film coating are:


· Primary sticky tree I


·Main sticky resin II


·Main sticky resin III


· Tackifying resin I


·Tackifying resin II


· Modification modifier G


·Anti-aging agent K


2. The use of hot melt adhesive film process (see Figure 3)


Hot melt adhesive synthesis → Hot melt adhesive coating of BOPP film → Composite of hot melt adhesive pre-coating film and paper print


3. Film using hot melt adhesive conditions (see Figure 4)



Figure 4 hot melt adhesive film using conditions


4. The technical core of hot melt adhesive for film coating;


1 affinity for BOPP;


2 affinity for ink;


3BOP heat shrinkability;


4 ink color change.


5. Film and hot melt adhesive characteristics (see Figure 5):


Synthesis temperature (≤200°C)> Coating temperature (≤130°C)> Compound temperature (≤110°C)

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